Standardisation sequence protocol for polishing post processing of conventional heat cure made with vacuum mixing while packing and long curing cycle , 3d printed occlusal splints fabricated from form lab dental lt clear resin sla technique and pmma milled occlusal splint from 5axis milling machine
occlusal splint polishing surface roughness 3D printed PMMA milled
polishing protocol 3D printed FormLabs dental LT clear SLA occlusal splint post processing sequence surface finish
https://dental.formlabs.com/indications/splints-and-occlusal…
occlusal splint surface roughness milled printed conventional acrylic
PMID: 38916682
CAD-CAM milled PMMA dental prosthesis surface roughness polishing
PMMA milled occlusal splint 5-axis polishing protocol surface roughness Ra sequence steps dental laboratory
https://www.zora.uzh.ch/server/api/core/bitstreams/e76fa399-…
PMID: 39895617
| Step | Instrument/Material | Notes |
|---|---|---|
| 1. Deflasking | Flask press + spatula | Allow flask to cool to room temperature before opening - do not quench in water (causes warpage/stress cracking) |
| 2. Gross excess removal | Straight handpiece + acrylic tungsten carbide (TC) bur or 12-bladed carbide trimmer | Remove flash, flange excess, sprues. Work in gentle strokes. Do not overheat |
| 3. Contour refinement | Green mounted stone (silicon carbide) or brown rubber point | Shape occlusal contacts, borders, and intaglio relief areas - keep water cooling |
| 4. Smoothing | White Arkansas stone or medium rubber abrasive point | Progressively smooth all convex and concave surfaces; reduce visible bur marks |
| 5. Wet abrasive paper - coarse | 320-grit wet silicon carbide paper under running water | Eliminates mounted-stone scratches; move in one direction only |
| 6. Wet abrasive paper - medium | 600-grit wet silicon carbide paper | Removes 320-grit scratches |
| 7. Wet abrasive paper - fine | 800-grit wet silicon carbide paper | Transitional smoothing |
| 8. Wet abrasive paper - extra fine | 1000-grit wet silicon carbide paper | Surface should appear uniformly matte-smooth at this stage |
| 9. Pumice slurry (lathe) | Rag wheel on lathe + medium pumice slurry (Pumice powder + water) at ~1500 RPM | Apply moderate pressure; keep part moving to avoid localised heat buildup; rinse thoroughly after |
| 10. High-shine compound (lathe) | Clean dry rag wheel + Acrylic high-shine polishing compound (e.g., Acryshine, Tripoli) at ~1500 RPM | Part must be fully dry and pumice-free; this step yields optical clarity |
| 11. Felt/chamois wheel (optional refinement) | Chamois or flannel buff + final acrylic glaze | For maximum optical clarity on labial/buccal surfaces |
| 12. Ultrasonic cleaning | Ultrasonic bath in water + mild detergent, 5 min | Removes all polishing residue from intaglio surface and margins |
| 13. Final inspection | Profilometer or visual/tactile check | Target Ra ≤ 0.2 µm; occlusal contacts rechecked on articulator |
| Step | Procedure | Critical Details |
|---|---|---|
| 1. Part removal | Remove from Form 4 / Form 3B+ build platform using quick-release handles or spatula | Wear nitrile gloves - uncured resin is a skin sensitiser |
| 2. IPA wash (Form Wash) | Wash in 99% IPA (or Formlabs IPA substitute) for the recommended time per LT Clear V2 manufacturing guide | Dedicated tank and build platform required for biocompatibility compliance |
| 3. IPA rinse | Transfer to clean IPA for a short secondary rinse | Ensures no cross-resin contamination |
| 4. Drying | Air dry minimum 30 minutes OR compressed air blow-off | No residual IPA or liquid resin on surface - critical for post-cure uniformity |
| 5. Visual inspection | Check all surfaces under bright light for wet spots or resin pooling | If wet areas present, extend drying time |
| 6. Post-cure (Form Cure) | Form Cure at recommended time + temperature for LT Clear V2 (typically 60°C, refer to current manufacturing guide) | Do NOT exceed recommended time - causes yellowing/discolouration |
| 7. Cool completely | Room temperature bench cooling | Remove supports only AFTER post-cure + full cooling (prevents warpage) |
| Step | Instrument/Material | Notes |
|---|---|---|
| 8. Support removal | Flush cutters (Formlabs Finish Kit), carbide bur, or double-sided diamond disc in handpiece | Cut at support touchpoints; do not tear. Brittle after cure - use controlled force |
| 9. Touchpoint smoothing | Medium Scotch-Brite wheel, green SiC stone, or silicone rubber bur at low speed | Smooth support nubs flush with surface; avoid heat generation |
| 10. Coarse contouring (handpiece) | Silicone carbide abrasive disc (e.g., Sof-Lex / Soflex XT, medium grit) | Address any layer-step artefacts or touchpoint remnants |
| 11. Pre-polish - abrasive paper | 320 → 400 → 600 → 800 → 1000 grit wet silicon carbide paper under running water | Start at 600 if surface is already smooth; work sequentially; 3D-printed surfaces can have higher Ra (up to 0.7-2.0 µm unpolished depending on build orientation) |
| 12. Fine pre-polish | 1500 → 2000 grit wet paper OR soft silicone diamond disc | Surface begins to appear semi-translucent |
| 13. Polishing with handpiece | Silicone diamond disc (fine) + soft felt or wool wheel with high-gloss acrylic compound | Apply in smooth passes; avoid static pressure in one spot |
| 14. Final polish (lathe - option A) | Rag wheel with pumice slurry → clean rag wheel with high-shine acrylic compound | Follow identical sequence as conventional method; Formlabs application guide confirms this is appropriate for LT Clear |
| 15. Final polish (handpiece - option B) | High-gloss compound with felt wheel → finish with wool wheel | Achieves equivalent result if lathe unavailable |
| 16. Ultrasonic clean | Ultrasonic bath 5 min in water + detergent | Essential - removes abrasive particles from undercuts |
| 17. Final inspection + occlusal check | Ra check (target ≤ 0.2 µm) + re-seat on model | Recheck intaglio fit - dimensional check critical as SLA has a print tolerance |
| Step | Instrument/Material | Notes |
|---|---|---|
| 1. Milling mark assessment | Visual + tactile inspection | Identify tool-path ridges, sprue attachment site, internal surface quality |
| 2. Sprue/attachment removal | TC carbide bur at handpiece | Remove milling attachment block; smooth attachment point only - most of the surface requires minimal intervention |
| 3. Fine contouring (if needed) | Fine-grit silicone carbide disc or fine rubber point | Only in areas with visible toolpath ridges or adjusted contact areas - do not over-instrument smooth surfaces |
| 4. Wet abrasive paper - start at fine grit | 600-grit (or directly 800-grit) wet silicon carbide paper | Milled surfaces typically skip coarser grits (320/400 not needed unless deep bur marks present) |
| 5. Wet abrasive paper - extra fine | 1000-grit wet silicon carbide paper | Standardise surface texture |
| 6. Pumice slurry (optional/minimal) | Rag wheel + fine pumice slurry | May be reduced or skipped if Ra already below threshold post-1000 grit - check with profilometer |
| 7. High-shine compound | Rag or felt wheel + acrylic high-shine compound at lathe | Produces the final optical finish; milled PMMA polishes more rapidly than heat-cure due to higher density and lower porosity |
| 8. Ultrasonic clean | Ultrasonic bath 5 min | Removes polishing compound and metal particles from 5-axis milling |
| 9. Final inspection + occlusal verification | Profilometer (Ra check) + articulator | Verify CAD/CAM contacts are maintained - polishing should not flatten contact ramps |
| Parameter | Conventional Heat-Cure | SLA (FormLabs LT Clear) | CAD/CAM Milled PMMA |
|---|---|---|---|
| Starting Ra (unpolished) | 0.29-0.54 µm | 0.28-2.1 µm (orientation-dependent) | 0.085-0.12 µm |
| Mandatory pre-polish step | None (deflask + trim only) | Full IPA wash + post-cure mandatory | None (direct from mill) |
| Grit sequence start | 320 grit | 320-600 grit (higher if layered surface present) | 600-800 grit (coarser steps often unnecessary) |
| Pumice step | Always required | Required (after adequate grit progression) | Optional if already near threshold |
| High-shine compound | Required | Required | Required |
| Achieved Ra post-polish | 0.048-0.064 µm | 0.052-0.057 µm | 0.035-0.042 µm |
| Biofilm risk post-polish | Low | Low (below 0.2 µm threshold) | Lowest |
| Polishing difficulty | Moderate (hand polishing works) | High (support marks require care) | Low-moderate (mainly toolpath ridges) |